PhD scholarship in Streamlining quantum chip packaging through 3D printed self-alignment structures - DTU Nanolab

Opportunity summary

Are you interested in quantum chip packaging from both a theoretical and experimental point of view? Then this PhD project offers a unique opportunity. If you have a background in 3D design, microfabrication, and a good understanding of the interplay between materials, topology, and mechanical properties, you might be our ideal PhD candidate. Your work at DTU Nanolab would contribute to developing quick and facile solutions for alignment in photonic integrated circuit (PIC) packaging, potentially revolutionizing PIC packaging and system integration and ultimately contributing to high bandwidth and secure data transmission. Responsibilities and qualifications Your overall focus will be to design and fabricate self-alignment structures for flip-chip bonding based on lightweight high-strength and auxetic materials. You will work together closely with our collaborators at KAIST on the topic of AI-assisted inverse design, and with your colleagues at DTU Nanolab for the fabrication and characterization of the designed structures. Your primary tasks will be to: Design lightweight yet mechanically stable self-alignment structures for PIC packaging Fabricate the designed1 …

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